Light-emitting diode lighting device

ABSTRACT

A light-emitting diode (LED) lighting device includes a substrate, a first bottom electrode, a bottom transparent isolation layer, a first vertical LED, a second vertical LED, a first top transparent electrode, and a second top transparent electrode. The first bottom electrode is disposed on the substrate and is reflective. The first vertical LED and the second vertical LED are disposed on the first bottom electrode. The bottom transparent isolation layer covers the substrate and the first bottom electrode and exposes the first vertical LED and the second vertical LED. The first top transparent electrode is electrically connected to the first vertical LED. The second top transparent electrode is electrically connected to the second vertical LED. The first top transparent electrode, the second top transparent electrode, and the first bottom electrode cooperate to electrically connect the first vertical LED and the second vertical LED in series.

BACKGROUND

In recent years, light-emitting diode (LED) technologies have improved alot, and LEDs with high power and high brightness have been presented tothe market. In addition, the LEDs used as light bulbs have the advantageof long lifetime. Therefore, such LED light bulbs have the tendency toreplace other conventional light sources. LEDs can be applied to varioustypes of lamps, such as traffic lights, street lights, and flashlights.

Since LEDs gradually become mainstream light sources, improvingproperties of LEDs becomes an important issue, and this becomes the maingoal in the R&D departments of the LED industries.

SUMMARY

This disclosure provides a light-emitting diode (LED) lighting device toachieve high power, high luminous efficiency, and longer lifetime.

In one aspect of the disclosure, a LED lighting device is provided. TheLED lighting device includes a substrate, at least one first bottomelectrode, a bottom transparent isolation layer, at least one firstvertical LED, at least one second vertical LED, a first top transparentelectrode, and a second top transparent electrode. The first bottomelectrode is disposed on the substrate, in which the first bottomelectrode is reflective. The bottom transparent isolation layer coversthe substrate, in which the bottom transparent isolation layer has afirst opening and a second opening therein to respectively expose atleast a first part and a second part of the first bottom electrode. Thefirst vertical LED is disposed on the first exposed part of the firstbottom electrode. The second vertical LED is disposed on the secondexposed part of the first bottom electrode. The first top transparentelectrode is electrically connected to the first vertical LED. Thesecond top transparent electrode is electrically connected to the secondvertical LED, in which the first top transparent electrode, the secondtop transparent electrode, and the first bottom electrode cooperate toelectrically connect the first vertical LED and the second vertical LEDin series.

By electrically connecting the first vertical LED and the secondvertical LED in series, the LED lighting device can achieve high powerand high luminous efficiency by electrically connecting to a powersupply with high voltage. In addition, the current passing the firstvertical LED and the second vertical LED needs not to be large toachieve high power and high luminous efficiency. Therefore, the lifetimeof the first vertical LED and the second vertical LED may be longer, andcooling may not become a problem.

It is to be understood that both the foregoing general description andthe following detailed description are by examples, and are intended toprovide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention can be more fully understood by reading the followingdetailed description of the embodiment, with reference made to theaccompanying drawings as follows:

FIG. 1 is a schematic cross-sectional view of a light-emitting diode(LED) lighting device according to one embodiment of this disclosure;

FIG. 2 is a schematic cross-sectional view of the LED lighting deviceaccording to another embodiment of this disclosure;

FIG. 3A is a schematic top view of the LED lighting device according toone embodiment of this disclosure;

FIG. 3B is a schematic top view of the LED lighting device according toanother embodiment of this disclosure;

FIGS. 4A to 4C are horizontal cross-sectional views of a patterneddielectric layer according to different embodiments of this disclosure;

FIG. 5 is a schematic cross-sectional view of the LED lighting deviceaccording to another embodiment of this disclosure;

FIG. 6 is a schematic cross-sectional view of the LED lighting deviceaccording to another embodiment of this disclosure; and

FIG. 7 is a schematic cross-sectional view of the LED lighting deviceaccording to another embodiment of this disclosure.

DETAILED DESCRIPTION

In the following detailed description, for purposes of explanation,numerous specific details are set forth in order to provide a thoroughunderstanding of the disclosed embodiments. It will be apparent,however, that one or more embodiments may be practiced without thesespecific details. In other instances, well-known structures and devicesare schematically depicted in order to simplify the drawings.

FIG. 1 is a schematic cross-sectional view of a light-emitting diode(LED) lighting device 100 according to one embodiment of thisdisclosure. As shown in FIG. 1, an LED lighting device 100 is provided.The LED lighting device 100 includes a substrate 110, a bottom electrode121, a bottom transparent isolation layer 130, vertical LEDs 200 and300, and top transparent electrodes 142 and 144. The bottom electrode121 is disposed on the substrate 110, and the bottom electrode 121 isreflective. The bottom transparent isolation layer 130 covers thesubstrate 110, and the bottom transparent isolation layer 130 hasopenings 132 and 134 therein to respectively expose at least parts 122and 123 of the bottom electrode 121. The vertical LEDs 200 and 300 arerespectively disposed on the exposed parts 122 and 123 of the bottomelectrode 121. The top transparent electrodes 142 and 144 arerespectively electrically connected to the vertical LEDs 200 and 300.The top transparent electrodes 142 and 144 and the bottom electrode 121cooperate to electrically connect the vertical LEDs 200 and 300 inseries.

By electrically connecting the vertical LEDs 200 and 300 in series, theLED lighting device 100 can achieve high power and high luminousefficiency. In addition, the current passing through the vertical LEDs200 and 300 can remain small to enhance the lifetime of the verticalLEDs 200 and 300 and reduce heat generated by the vertical LEDs 200 and300.

Specifically, for example, if the voltage difference of each of thevertical LEDs 200 and 300 is 3.125 volts and the current passing throughthe vertical LEDs 200 and 300 is 1 ampere, the power of the combinationof the vertical LEDs 200 and 300 is 6.25 watts. If a single LED is usedto achieve the same power, the current should be 2 amperes. As a result,the single LED may have a shorter lifetime due to the larger passingcurrent, and the cooling of the single LED may also be more difficult.

Because the LED lighting device 100 employs the top transparentelectrodes 142 and 144 as its top electrode to interconnect differentelectronic components, a wire bonding process may not be needed.Therefore, the process yield of the LED lighting device 100 is improved,and the manufacturing cost of the LED lighting device 100 is lowered.

The substrate 110 has a high thermal conductivity. Specifically, thesubstrate 110 is made of silicon, such as undoped silicon, p-typesilicon, or n-type silicon, or a ceramic material.

When the substrate 110 is made of silicon, the potential of thesubstrate 110 may be operated to be the lowest among all elements of theLED lighting device 100, such that the contact surface of the substrate110 and the conductive elements above the substrate 110 (for example,the bottom electrode 121 or the top transparent electrodes 142) totallyor partially form a reverse bias of p-n junction. Therefore, thesubstrate 110 is electrically insulated from the conductive elementsabove the substrate 110.

Embodiments of this disclosure are not limited thereto. FIG. 2 is aschematic cross-sectional view of the LED lighting device 100 accordingto another embodiment of this disclosure. As shown in FIG. 2, thesubstrate 110 includes an insulation layer 112 and a conductive layer114. The insulation layer 112 may be made of silicon dioxide (SiO₂),which may be oxidized from silicon. The conductive layer 114 may be madeof metal such as aluminium, and the conductive layer 114 may function asa heat-dissipating layer.

The potential of the substrate 110 may be operated to be theintermediate value of the maximum potential and the minimum potentialamong all elements of the LED lighting device 100, such that thepotential differences between the substrate 110 and the conductiveelements above the substrate 110 (for example, the bottom electrode 121or the top transparent electrodes 142) are not too large. Therefore, thecurrent does not pass through the insulation layer 112, and thus thesubstrate 110 is electrically insulated from the conductive elementsabove the substrate 110.

The bottom electrode 121 is made of metal, such as silver. Embodimentsof this disclosure are not limited thereto. In other embodiments, thebottom electrode 121 is a multi-layer structure. For example, the bottomelectrode 121 is a double-layer structure made of copper and silver or atriple-layer structure made of copper, titanium, and silver. The bottomelectrode 121 functions as a reflective layer to reflect light emittedfrom the vertical LEDs 200 and 300 to forward upwardly.

The vertical LEDs 200 and 300 are in reversed electricity polarity.Specifically, the vertical LED 200 further includes a firstsemiconductor layer 210 proximal to the top transparent electrode 142and a second semiconductor layer 220 proximal to the bottom electrode121. The vertical LED 300 further includes a first semiconductor layer310 proximal to the bottom electrode 121 and a second semiconductorlayer 320 proximal to the top transparent electrode 144. The firstsemiconductor layers 210 and 310 of the vertical LEDs 200 and 300 are ofthe same type, and the second semiconductor layers 220 and 320 of thevertical LEDs 200 and 300 are of the same type.

More specifically, the first semiconductor layers 210 and 310 of thevertical LEDs 200 and 300 are n-type semiconductor layers, and thesecond semiconductor layers 220 and 320 of the vertical LEDs 200 and 300are p-type semiconductor layers. Embodiments of this disclosure are notlimited thereto. In other embodiments, the first semiconductor layers210 and 310 of the vertical LEDs 200 and 300 are p-type semiconductorlayers, and the second semiconductor layers 220 and 320 of the verticalLEDs 200 and 300 are n-type semiconductor layers.

The first semiconductor layers 210 and 310 and the second semiconductorlayers 220 and 320 can be made of gallium nitride (GaN). People havingordinary skill in the art can make proper modifications to the materialof the first semiconductor layers 210 and 310 and the secondsemiconductor layers 220 and 320 depending on the actual application.

The vertical LED 200 further includes an active layer 230 disposedbetween the first semiconductor layer 210 and the second semiconductorlayer 220. The vertical LED 300 further includes an active layer 330disposed between the first semiconductor layer 310 and the secondsemiconductor layer 320. Specifically, the active layer 230 and 330 canbe multiple-quantum-well structures.

The bottom transparent isolation layer 130 has a high refractive index.Specifically, the refractive index of the bottom transparent isolationlayer 130 is larger than 1.5. The bottom transparent isolation layer 130may reduce total reflection in the vertical LEDs 200 and 300 and thusenhance the light extraction of the vertical LEDs 200 and 300.

The top transparent electrodes 142 and 144 are made of indium tin oxide(ITO). People having ordinary skill in the art can make propermodifications to the material of the top transparent electrodes 142 and144 depending on the actual application.

The top transparent electrodes 142 and 144 may be patterned from atransparent conductive layer. The patterning of top transparentelectrodes 142 and 144 is performed by a developing and etching processor a screen printing and etching process.

The LED lighting device 100 further includes a bottom electrode 126disposed on the substrate 110, vertical LEDs 400 and 500, and toptransparent electrode 146. The bottom transparent isolation layer 130further has openings 136 and 138 therein to expose at least parts 127and 128 of the second bottom electrode 126. The vertical LEDs 400 and500 disposed on the exposed parts 136 and 138 of the bottom electrode126. The top transparent electrode 144 is further electrically connectedto the vertical LED 400. The top transparent electrode 146 iselectrically connected to the vertical LED 500. The bottom electrodes121 and 126 and the top transparent electrodes 142, 144, and 146cooperate to electrically connect the vertical LEDs 200, 300, 400, and500 in series.

The vertical LEDs 300 and 400 are in reversed electricity polarity.Specifically, the vertical LED 400 includes a first semiconductor layer410 proximal to the top transparent electrode 144 and a secondsemiconductor layer 420 proximal to the bottom electrode 126. The firstsemiconductor layers 310 and 410 of the vertical LEDs 300 and 400 are ofthe same type, and the second semiconductor layers 320 and 420 of thevertical LEDs 300 and 400 are of the same type.

The vertical LEDs 400 and 500 are in reversed electricity polarity. Thevertical LED 500 further includes a first semiconductor layer 510proximal to the bottom electrode 126 and a second semiconductor layer520 proximal to the top transparent electrode 146. The firstsemiconductor layers 410 and 510 of the vertical LEDs 400 and 500 are ofthe same type, and the second semiconductor layers 420 and 520 of thevertical LEDs 400 and 500 are of the same type.

Similarly, the LED lighting device 100 may further includes additionalbottom electrodes, top transparent electrodes, and vertical LEDs, andall of the vertical LEDs are electrically connected to each other inseries via the bottom electrodes and the top transparent electrodes.FIG. 3A is a schematic top view of the LED lighting device 100 accordingto one embodiment of this disclosure. For example, as shown in FIG. 3A,the LED light device 100 further includes bottom electrodes 191 and 192,top transparent electrodes 148 and 149, and vertical LEDs 610, 620, 630,and 640, and the vertical LEDs 200, 300, 400, 500, 610, 620, 630, and640 are electrically connected to each other in series via the bottomelectrodes 121, 126, 191, and 192 and the top transparent electrodes142, 144, 146, 148, and 149.

The LED lighting device 100 further includes an input electrode 710 andan output electrode 720 respectively electrically connected to the toptransparent electrodes 142 and 149 for allowing a power supply to beelectrically connected thereto. The input electrode 710 and the outputelectrode 720 are single-layer structures or multi-layer structures, andthe input electrode 710 and the output electrode 720 are made ofconductive materials. For example, the input electrode 710 and theoutput electrode 720 are single-layer structures made of silver,double-layer structures made of copper and silver, or triple-layerstructures made of copper, titanium, and silver. In addition, the inputelectrode 710, the output electrode 720, and the bottom electrodes 121,126, 191, and 192 may be formed in the same process.

Specifically, the shape of the substrate 100 is a cuboid, and the bottomelectrodes, top transparent electrodes, and vertical LEDs are disposedin a line. Embodiments of this disclosure are not limited thereto. Theshape of the substrate 100 may be a cylindrical column, a triangularprism, a cube, a cuboid, a hexagonal column, an octagonal column, or apolygon column. FIG. 3B is a schematic top view of the LED lightingdevice according to another embodiment of this disclosure. For example,as shown in FIG. 3B, the shape of the substrate 100 is a cylindricalcolumn, and the bottom electrodes, top transparent electrodes, andvertical LEDs are disposed in a ring.

Similarly, the shape of the bottom electrode 122, 124, 126, 191, and 192may be a cylindrical column, a cube, a cuboid, a dumbbell-shaped column,or a polygon column. The shape of the LEDs 200, 300, 400, 500, 610, 620,630, and 640 may be a cylindrical column, a cube, a cuboid, a hexagonalcolumn, an octagonal column, or a polygon column. The shape of the toptransparent electrodes 142, 144, 146, 148, and 149 may be a cylindricalcolumn, a cube, a cuboid, a hexagonal column, an octagonal column, or apolygon column. The shape of the input electrode 710 and the outputelectrode 720 may be a cylindrical column, a cube, a cuboid, a hexagonalcolumn, an octagonal column, or a polygon column.

As shown in FIG. 1, the first vertical LED 200 further includes apatterned dielectric layer 240. The patterned dielectric layer 240 isdisposed between the first semiconductor layer 210 and the toptransparent electrode 142. The patterned dielectric layer 240 covers anedge portion of the first semiconductor layer 210 and has an opening242. The top transparent electrode 142 is electrically connected to thevertical LED 200 through the opening 242. The function of the patterneddielectric layer 240 is to prevent the surface recombination of thevertical LED 200 and to prevent the leakage of the current through theside surface of the vertical LED 200, thereby enhancing the luminousefficiency of the vertical LED 200.

Specifically, the patterned dielectric layer 240 is made of siliconnitride or silicon dioxide. The patterning of the patterned dielectriclayer 240 is performed by a developing and etching process or a screenprinting and etching process.

The vertical LED 200 further includes a guard ring 250 disposed on thepatterned dielectric layer 240. The function of the guard ring 250 is toprevent electrostatic discharge (ESD) and to make the current in the toptransparent electrode 142 spread and evenly enter the vertical LED 200.

Specifically, the guard ring 250 is made of metal, such as silver. Thepatterning of the guard ring 250 is performed by a developing andetching process or a screen printing and etching process. If the shapesof the horizontal cross-sections of the patterned dielectric layer 240and the guard ring 250 are the same, the patterning of the guard ring250 may be used as the mask of the patterned dielectric layer 240.

FIGS. 4A to 4C are horizontal cross-sectional views of the patterneddielectric layer 240 according to different embodiments of thisdisclosure. As shown in FIGS. 4A to 4C, the shape of the horizontalcross-section of the patterned dielectric layer 240 may be a ring, aring with a cross, or a plurality of rings with a cross. The shape ofthe horizontal cross-section of guard ring 250 may be similar to theshape of the horizontal cross-section of the patterned dielectric layer240. Specifically, the shape of the horizontal cross-section of guardring 250 may be a ring, a ring with a cross, or a plurality of ringswith a cross.

As shown in FIG. 1, other vertical LEDs such as vertical LED 300 or 400may have patterned dielectric layer and the guard ring similar to thevertical LED 200 as well.

The LED lighting device 100 further includes an auxiliary electrode 150disposed between the vertical LED 300 and the vertical LED 400 (or theopening 134 and the opening 136) and electrically coupled with the toptransparent electrode 144. The auxiliary electrode 150 is made of metal.The function of the auxiliary electrode 150 is to enhance theconductivity of the top transparent electrode 144.

The auxiliary electrode 150 is isolated from the bottom electrodes 121and 126. The patterning of the auxiliary electrode 150 is performed by adeveloping and etching process or a screen printing and etching process.

The LED lighting device 100 further includes at least one toptransparent isolation layer 160 covering at least one of the verticalLEDs 200, 300, 400, and 500. The top transparent isolation layer 160 hasa high refractive index. Specifically, the refractive index of the toptransparent isolation layer is greater than 1.5. The top transparentisolation layer 160 may reduce total reflection in the LED light device100 and thus enhance the light extraction of the vertical LEDs 200, 300,400, and 500.

Specifically, a part of the top transparent isolation layer 160 coversthe vertical LED 200 and 300, and another part of top transparentisolation layer 160 covers the vertical LEDs 400 and 500.

In some embodiments, the number of the top transparent isolation layers160 is at least two, and the top transparent isolation layers 160 arestacked. The refractive indices of the top transparent isolation layers160 increase toward the vertical LEDs 200 and 300 or the vertical LEDs400 and 500, and the number of the top transparent isolation layers 160is up to 5.

The material of the top transparent isolation layer 160 may be the sameas the material of the bottom transparent isolation layer 130. Peoplehaving ordinary skill in the art can make proper modifications to thematerial of the top transparent isolation layer 160 depending on theactual application.

The LED lighting device 100 further includes a phosphor layer 170disposed on the top transparent isolation layer 160 covering at leastone of the vertical LEDs 200, 300, 400, and 500.

Specifically, a part of the phosphor layer 170 covers the vertical LED200 and 300, and another part of the phosphor layer 170 covers thevertical LEDs 400 and 500.

The refractive index of the bottom transparent isolation layer 130 isgreater than or equal to the refractive index of the phosphor layer 170,and the refractive index of the top transparent isolation layer 160 isgreater than or equal to the refractive index of the phosphor layer 170.

The top transparent isolation layer 160 is shaped to allow optical pathlengths from at least one of the vertical LEDs 200, 300, 400, and 500through different portions of the phosphor layer 170 to be substantiallythe same. Specifically, the top transparent isolation layer 160 issubstantially dome shaped. Therefore, the color of the light passing thephosphor layer 170 is even. The situation that the color of some of thelight passing the phosphor layer 170 is yellowish and the color of theother of the light passing the phosphor layer 170 is bluish is avoided.

The LED lighting device 100 further includes an encapsulation layer 180disposed on the phosphor layer 170. The encapsulation layer 180 coversat least one of the vertical LEDs 200, 300, 400, and 500. Specifically,a part of the encapsulation layer 180 covers the vertical LEDs 200 and300, and another part of the encapsulation layer 180 covers the verticalLEDs 400 and 500. Embodiments of this disclosure are not limitedthereto. FIG. 5 is a schematic cross-sectional view of the LED lightingdevice 100 according to another embodiment of this disclosure. As shownin FIG. 5, the encapsulation layer 180 integrally covers the verticalLEDs 200, 300, 400 and 500.

FIG. 6 is a schematic cross-sectional view of the LED lighting device100 according to another embodiment of this disclosure. As shown in FIG.6, the top transparent isolation layer 160 integrally covers thevertical LEDs 200, 300, 400 and 500. The phosphor layer 170 integrallycovers the vertical LEDs 200, 300, 400 and 500. The encapsulation layer180 integrally covers the vertical LEDs 200, 300, 400 and 500.

Each of the aforementioned vertical LEDs may be electrically connectedto additional vertical LEDs in parallel via the top transparentelectrode and the bottom electrode. FIG. 7 is a schematiccross-sectional view of the LED lighting device 100 according to anotherembodiment of this disclosure. For example, as shown in FIG. 7, the LEDlighting device 100 further includes a vertical LED 800 disposed on thebottom electrode 121. The bottom transparent isolation layer 130 furtherhas an opening 139 therein to expose at least a part 801 of the verticalLED 800, the top transparent electrode 142 is further electricallyconnected to the vertical LED 800 through the opening 139, and the toptransparent electrode 142 and the bottom electrode 121 cooperate toelectrically connect the vertical LEDs 200 and 800 in parallel.

Specifically, The vertical LED 800 includes a first semiconductor layer810 proximal to the top transparent electrode 142 and a secondsemiconductor layer 820 proximal to the bottom electrode 121. The firstsemiconductor layers 210 and 810 of the vertical LEDs 200 and 800 are ofthe same type, and the semiconductor layers 220 and 820 of the verticalLEDs 200 and 800 are of the same type.

Additionally, the number of the vertical LEDs on the bottom electrode121 and the number of the vertical LEDs on the bottom electrode 126 maybe the same or different. For example, as shown in FIG. 1, the number ofthe vertical LEDs on the bottom electrode 121 is two, and the number ofthe vertical LEDs on the bottom electrode 126 is two as well. As shownin FIG. 7, the number of the vertical LEDs on the bottom electrode 121is three, and the number of the vertical LEDs on the bottom electrode126 is two.

By electrically connecting the vertical LEDs in series, the LED lightingdevice 100 can achieve high power and high luminous efficiency byelectrically connecting to a power supply with high voltage. Inaddition, the current passing the vertical LEDs needs not to be large toachieve high power and high luminous efficiency. Therefore, the lifetimeof the vertical LEDs may be longer, and cooling may not become aproblem.

All the features disclosed in this specification (including anyaccompanying claims, abstract, and drawings) may be replaced byalternative features serving the same, equivalent or similar purpose,unless expressly stated otherwise. Thus, unless expressly statedotherwise, each feature disclosed is one example only of a genericseries of equivalent or similar features.

Any element in a claim that does not explicitly state “means for”performing a specified function, or “step for” performing a specificfunction, is not to be interpreted as a “means” or “step” clause asspecified in 35 U.S.C. §112, 6th paragraph. In particular, the use of“step of” in the claims herein is not intended to invoke the provisionsof 35 U.S.C. §112, 6th paragraph.

1. A light-emitting diode (LED) lighting device, comprising: asubstrate; at least one first bottom electrode disposed on thesubstrate, wherein the first bottom electrode is reflective; a bottomtransparent isolation layer covering the substrate, wherein the bottomtransparent isolation layer has a first opening and a second openingtherein to respectively expose at least a first part and a second partof the first bottom electrode; at least one first vertical LED disposedon the first exposed part of the first bottom electrode; at least onesecond vertical LED disposed on the second exposed part of the firstbottom electrode, wherein the other part of the first bottom electrodesurrounds the first part and the second part of the first bottomelectrode and is configured to reflect light emitted from the firstvertical LED and the second vertical LED; a first top transparentelectrode electrically connected to the first vertical LED; a second toptransparent electrode electrically connected to the second vertical LED,wherein the first top transparent electrode, the second top transparentelectrode, and the first bottom electrode cooperate to electricallyconnect the first vertical LED and the second vertical LED in series; asecond bottom electrode disposed on the substrate, wherein a bottomtransparent isolation layer has a third opening therein to expose atleast a part of the second bottom electrode; at least one third verticalLED disposed on the exposed part of the second bottom electrode, whereinthe second top transparent electrode is further electrically connectedto the third vertical LED, and the first bottom electrode, the secondtop transparent electrode, and the second bottom electrode cooperate toelectrically connect the second vertical LED and the third vertical LEDin series; and at least one auxiliary electrode disposed between thesecond vertical LED and the third vertical LED and electrically coupledwith the second top transparent electrode, wherein the auxiliaryelectrode is made of metal.
 2. The LED lighting device of claim 1,wherein the first vertical LED comprises: a first semiconductor layerproximal to the first top transparent electrode; and a secondsemiconductor layer proximal to the first bottom electrode; and thesecond vertical LED comprises: a first semiconductor layer proximal tothe first bottom electrode; and a second semiconductor layer proximal tothe second top transparent electrode, wherein the first semiconductorlayers of the first vertical LED and the second vertical LED are of thesame type, and the second semiconductor layers of the first vertical LEDand the second vertical LED are of the same type.
 3. The LED lightingdevice of claim 1, wherein the first bottom electrode is made of metal.4. The LED lighting device of claim 1, further comprising: a thirdvertical LED disposed on the first bottom electrode, wherein the bottomtransparent isolation layer has a third opening therein to expose atleast a part of the third vertical LED, the first top transparentelectrode is further electrically connected to the third vertical LEDthrough the third opening, and the first top transparent electrode andthe first bottom electrode cooperate to electrically connect the firstvertical LED and the third vertical LED in parallel.
 5. The LED lightingdevice of claim 4, wherein the first vertical LED comprises: a firstsemiconductor layer proximal to the first top transparent electrode; anda second semiconductor layer proximal to the first bottom electrode; andthe third vertical LED comprises: a first semiconductor layer proximalto the first top transparent electrode; and a second semiconductor layerproximal to the first bottom electrode, wherein the first semiconductorlayers of the first vertical LED and the third vertical LED are of thesame type, and the second semiconductor layers of the first vertical LEDand the third vertical LED are of the same type.
 6. (canceled)
 7. TheLED lighting device of claim 1, wherein the second vertical LEDcomprises: a first semiconductor layer proximal to the first bottomelectrode; and a second semiconductor layer proximal to the second toptransparent electrode; the third vertical LED comprises: a firstsemiconductor layer proximal to the second top transparent electrode;and a second semiconductor layer proximal to the second bottomelectrode, wherein the first semiconductor layers of the second verticalLED and the third vertical LED are of the same type, and the secondsemiconductor layers of the second vertical LED and the third verticalLED are of the same type.
 8. (canceled)
 9. The LED lighting device ofclaim 1, wherein the auxiliary electrode is physically isolated from thefirst bottom electrode and the second bottom electrode.
 10. The LEDlighting device of claim 1, wherein the auxiliary electrode is disposedbetween the second opening and the third opening.
 11. The LED lightingdevice of claim 1, wherein the first vertical LED comprises: a firstsemiconductor layer proximal to the first top transparent electrode; asecond semiconductor layer proximal to the first bottom electrode; anactive layer disposed between the first semiconductor layer and thesecond semiconductor layer; and a patterned dielectric layer disposedbetween the first semiconductor layer and the first top transparentelectrode and covering an edge portion of the first semiconductor layer.12. The LED lighting device of claim 11, wherein the first vertical LEDfurther comprises: a guard ring disposed on the patterned dielectriclayer.
 13. The LED lighting device of claim 1, further comprising: atleast one top transparent isolation layer covering at least one of thefirst vertical LED and the second vertical LED.
 14. The LED lightingdevice of claim 13, wherein the refractive index of the bottomtransparent isolation layer is greater than or equal to the refractiveindex of the top transparent isolation layer.
 15. The LED lightingdevice of claim 13, wherein the refractive indices of a plurality of thetop transparent isolation layers increase towards the first vertical LEDand the second vertical LED.
 16. The LED lighting device of claim 1,further comprising: a phosphor layer covering at least one of the firstvertical LED and the second vertical LED.
 17. The LED lighting device ofclaim 16, wherein the refractive index of the bottom transparentisolation layer is greater than or equal to the refractive index of thephosphor layer.
 18. The LED lighting device of claim 16, wherein opticalpath lengths from at least one of the first vertical LED and the secondvertical LED through different portions of the phosphor layer aresubstantially the same.
 19. The LED lighting device of claim 16, furthercomprising: at least one top transparent isolation layer disposedbetween the phosphor layer and the bottom transparent isolation layer,wherein the top transparent isolation layer is shaped to allow opticalpath lengths from at least one of the first vertical LED and the secondvertical LED through different portions of the phosphor layer to besubstantially the same.
 20. The LED lighting device of claim 19, whereinthe refractive index of the top transparent isolation layer is greaterthan or equal to the refractive index of the phosphor layer.
 21. The LEDlighting device of claim 19, further comprising: an encapsulation layerdisposed on the phosphor layer, wherein the encapsulation layer coversat least one of the first vertical LED and the second vertical LED. 22.The LED lighting device of claim 1, further comprising: an encapsulationlayer covering at least one of the first vertical LED and the secondvertical LED.